发明名称 CONSTRUCTION OF JUMPER BY SOLDER MATERIAL
摘要 PURPOSE:To eliminate the need of a jumper wire and dummy chip and to improve considerably productivity by coating creamy solder paste between conductors, atop the conductors and around the same, melting the paste and conducting electrically the conductors. CONSTITUTION:Conductors 2 are formed on a ceramic substrate 1 and a glass layer 3 is formed on the conductors 2. Creamy solder paste 4 is coated between the conductors 2, atop the conductors 2 and around the same. Such paste 4 is melted to conduct electrically the conductors 2 with each other by the solder material, by which the conductors are connected.
申请公布号 JPS6068187(A) 申请公布日期 1985.04.18
申请号 JP19830174307 申请日期 1983.09.22
申请人 HITACHI SEISAKUSHO KK 发明人 ISHII YOSHIYUKI
分类号 B23K35/14;H05K1/00;H05K1/03;H05K1/11;H05K3/22;H05K3/28;H05K3/40 主分类号 B23K35/14
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