| 摘要 |
PURPOSE:To facilitate to insert a capillary for wire connection in a container for housing a semiconductor element comprising an insulator substrate, wall members and a cover member, by forming each wall member having an inclined inner face to be thinner in the upper end and thicker in the portion applied to the substrate such that a wider space is defined by upper portions of the wall members. CONSTITUTION:A soldering material 15b is applied on a given section on the surface of an insulator substrate 11. A soldering material 15c is applied on the edges of the upper surface, the side walls and the edges of the bottom surface of the substrate 11. Further on the bottom face, a soldering material 15b' is provided in a position corresponding to the soldering material 15c. Then, wall members 12 are provided on the edges of the substrate 11 with soldering material 15c laid under the wall members, and these are covered with a cover member not shown in the drawing. Each wall member 12 is formed to have an inclined inner face so as to be thicker in its lower end. Thus, the area opened between the wall members 12 is enlarged, whereby it is facilitated to fix the semiconductor element on the soldering material 15b and to insert a capillary 19 for fixing the metallic thin wire 17 on the soldering material 15c on the upper surface of the substrate. |
