| 摘要 |
PURPOSE:To effectively dissipate the heat generated in a semiconductor element in a lead frame by a method in which a heat conductive material is filled immediately under the semiconductor element carrying section of the lead frame, a semiconductor element is affixed to the carrying section, and the lead frame is thereafter resin sealed such that the rear face of the heat conductive material is exposed to the air. CONSTITUTION:A lead frame consists of a section 11 for carrying a semiconductor element and of a plurality of leads 14 surrounding the section. A semiconductor element 12 is affixed to the carrying section 11 and the electrode wiring provided therein is connected to the leads 14 with metallic small-gage wires 13. A heat conductive material 16 is filled immediately under the carrying section of the lead frame to have a great thickness. This heat conductive material 16 is made of a resin with good heat conductivity, soldering agent or resin filled with a paste containing metallic particles. When the element 12, the ends of the leads 14, the small-gage wires 13 and the heat conductive material 16 are sealed with the resin 15, the rear face of the heat conductive material is exposed to the air. Thus the heat generated in the element 12 is dissipated directly from the rear face of the heat conductive material 16, whereby the effect for dissipating heat can be improved. |
