摘要 |
PURPOSE:To transfer a different kind of a lead frame by extending upper and lower fingers in such a manner as to open and close between guide rails for a lead frame, which are opposed parallel to each other in a lead frame transfer device for a semiconductor assembling machine. CONSTITUTION:When the leading end of a lead frame 12 pushed by a pusher 100 is brought into contact with upper and lower fingers 75A, 76A, a motor 93 is operated to turn a finger lever 34 through operation of a cam 88 and a follower 89 and movement of a support plate 83A, thereby to open an upper finger 75A. Similarly, a lower finger 76A is opened through a roller 81A. The same operation is conducted on the opposite side not shown. Subsequently, fingers 75A, 76A are moved to the loader side for a lead frame 12 for one device by a screw member 60 and a female screw member 66A and closed. After that, the screw member 60 and female screw member 66A are reversed to be pulled out for one device. Thus, a different kind of a lead frame can be transferred. |