首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
METHOD OF BONDING METAL COPPER ON SUBSTRATE
摘要
申请公布号
JPS6066896(A)
申请公布日期
1985.04.17
申请号
JP19840116747
申请日期
1984.06.08
申请人
INTERN BUSINESS MACHINES CORP
发明人
TOOMASU HOORU BAUMU;FURANSESU AN HOURU;KIYARORU RUUSU JIYOONZU
分类号
H05K3/14;C23C16/18;H01L21/28;H01L21/285
主分类号
H05K3/14
代理机构
代理人
主权项
地址
您可能感兴趣的专利
EEPROM MEMORY CELL FOR HIGH TEMPERATURES
A method of bandwidth extension for narrow-band speech
A process for preparing an Fe-based thixocast material
SIGNAL PROCESSING SYSTEM
PREGABALIN COMPOSITION
DUAL AXIS VIBRATORY RATE GYROSCOPE
Plasma display panel
Auction system and auction method using presence information and chat function
DIFFRACTION GRATING-BASED ENCODED ARTICLES FOR MULTIPLEXED EXPERIMENTS
RHODIUM-RICH OXYGEN BARRIERS
Method for transfering a running material web onto a winding core and winding machine
Gas turbine combustor and operating method
Transmission oil cooler
ERYTHROPOIETIN LIQUID FORMULATION
PORTABLE ELECTRONIC DEVICE PROVIDED WITH AN ANALOG DISPLAYED VARIOMETER FUNCTION
Ink-jet recording head
Carbon fiber having catalytic metal supported thereon
Method of manufacturing a metal-oxide varistor
METHOD FOR SELECTIVELY COATING CERAMIC SURFACES
Circuit and method for reducing overshoot in a switching regulator