摘要 |
A device and method for automatically removing fingernail polish from one or more fingernails at a time is described. In a preferred embodiment, the device has a rotating brush with soft bristles contained in a compartment having fingernail polish removing fluid. The fingers from which fingernail polish is to be removed are placed through an opening near the top of the compartment so that the fingernails press against the bristles of the brush. The brush, rotated by an electric motor, brushes the fingernail polish removing fluid against the fingernails and removes the fingernail polish. Fluid is kept within the compartment by means of a flexible diaphragm over the opening having slits therein for the fingers.
|