| 摘要 |
<p>PURPOSE:To make mass production at low cost and miniaturization of the titled elements feasible by a method wherein two each or more light emitting elements are arranged on the same substrate and two each or more light receiving elements are arranged on another substrate while these elements are confronted with one another through the intermediary of a light transmitting channel. CONSTITUTION:Light emitting diodes 9 made of GaAs etc. are die-bonded and wire-bonded on a substrate 7 while Si phototransistors 10 etc. are die-bonded and wire-bonded on another substrate 8 so that the phototransistor 10 may be confronted with the light emitting diodes 9 holding a light transmitting window 2 of a case 1 formed of resin not transmitting light to complete the multiple photocoupling elements. Through these procedures, the die-bonding and wire-bonding processes as well as sealing to the substrate of case 1 with less parts may be automated to make mass production of the elements at low cost feasible. On the other hand, the titled elements may be miniaturized easily subject to free arrangement of the terminals.</p> |
