| 摘要 |
Apparatus for enclosing semiconductors with resin by molding, including a stationary upper mold having a plurality of pots, and a movable lower mold opposed thereto. The upper and lower molds have cavities to which a resin material supplied to the pots is pressingly injected directly or only through gates. Disposed at the upper mold side is a resin material pressurizing mechanism having plungers fittable into the pots, and one or more cylinders and piston rods for actuating the plungers.
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