发明名称 Method of soldering circuit boards with solder-repellent contacts
摘要 PCT No. PCT/DE82/00082 Sec. 371 Date Dec. 6, 1982 Sec. 102(e) Date Dec. 6, 1982 PCT Filed Apr. 8, 1982 PCT Pub. No. WO82/03723 PCT Pub. Date Oct. 28, 1982.In a contact device having at least first and second contact surfaces which may be placed in electrically conducting contact with one another, that improvement which includes a solder-repellent and self-lubricating casing material applied to at least one of said contact surfaces. The solder-repellent contact surface also serves as a stop-off when soldering component leads to terminals of a printed circuit board.
申请公布号 US4511076(A) 申请公布日期 1985.04.16
申请号 US19840613749 申请日期 1984.05.23
申请人 BRAUN AKTIENGESELLSCHAFT 发明人 ROTH, JOHANN
分类号 H01C1/12;H01C10/30;H01H1/60;H01H19/58;H05K3/24;H05K3/34;(IPC1-7):H05K3/34 主分类号 H01C1/12
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