| 摘要 |
PURPOSE:To simplify a conveying device, to reduce middle mechanisms and to facilitate automation and the countermeasure to various kinds of manufacture of integrated circuit packages by a method wherein manufacturing processes are performed up to the final process in the condition holding connection between IC packages and a lead frame. CONSTITUTION:Plating process is performed to a lead frame 22 formed with IC packages 23 completed with a die bonding process 9, a wire bonding process 10 and a resin sealing process 11, the lead frames thereof are accommodated in a lead frame supply magazine 25, and the magazine is put in an MCB machine. The lead frames 22 thereof are supplied one sheet by one sheet to conveying rails 28 according to a lead frame supply device 27, item numbers, manufactured dates, etc. are printed according to a marking device 31 on the tops of the respective packages, the leads of the respective packages are cut from the lead frame according to a lead cut press 35, the leads are formed in the prescribed shape according to a lead bend press 40, and the respective package 23 are cut to be separated from the lead frame 22 according to a work cut press 46. |
