发明名称 MANUFACTURE OF SEMICONDUCTOR INTEGRATED CIRCUIT
摘要 PURPOSE:To improve the problems of a gate array type and a standard cell type and to satisfy both requests of the easiness of design and manufacture and flexible circuit design and layout design by manufacturing commonly with pad hold mask when manufacturing a plurality of types of semiconductor integrated circuits in series. CONSTITUTION:When manufacturing semiconductor integrated circuits of standard cell type of plural types, they are manufactured by securing only to the outer frame of a pad 2 and a chip 1. Symbols (a) and (b) designate different types of semiconductor integrated circuits, and the disposition of an inner cell 3 and wirings 4 are entirely different. A disposing wiring method of polycell type may be employed for the part to be freely designed at every type. Further, in the step of mounting the semiconductor integrated circuit, the pad positions are common. Accordingly, all are performed by a common method. When such a designing method is employed, the positions of the pads are fixed, and the masks of the pad holes opened for the protective film of the final manufacturing step become common. Therefore, the easiness of design and manufacture of the merits of a gate array can be applied to improve the complexity of the design and the manufacture.
申请公布号 JPS61240650(A) 申请公布日期 1986.10.25
申请号 JP19850081244 申请日期 1985.04.18
申请人 TOSHIBA CORP 发明人 YAMADA MASAAKI
分类号 H01L21/822;H01L21/82;H01L27/02;H01L27/04 主分类号 H01L21/822
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