| 摘要 |
PURPOSE:To readily construct a semiconductor device having wirings of arbitrary shape by laminating at least two or more of layers formed in the same layer of metal wirings and an insulating substance. CONSTITUTION:Part of a layer is a metal wiring section, and the other portion is an insulating section such as, an SiO2 layer. This layer is laminated so that the metal wiring section in the layer is laminated elevationally to form partly thick wirings. Wirings of free sectional shape can be also formed by simultaneously altering the width. |
