| 摘要 |
PURPOSE:To obtain an IC module having uniform thickness and uniform dimension by using a resin having high hardness as a sealing resin, thereby preventing a damage of a bonding portion and forming a filling layer with resin having less thermal shrinkage. CONSTITUTION:A polyethylene sheet 3 is contacted with a lower surface of a core material 1, and IC module 4 is mounted on a molding hole 2, and a sealing resin layer 8 is formed on a substrate 5. The sealing resin has good bondability to the substrate 5, an IC chip 6, and wirings 7 and high hardness. A resin 9 which has good bondability to the layer 8 and less shrinkage of heating and pressing is filled on the layer 8 in the degree of raising higher than the material 1. A thermal flexible film 10 is superposed on the resion 9 and the material 1, and the upper surface is flattened by pressing with a roller 11. Then, the resin 9 is hardened to form a filling layer 9'. Then, polyethylene sheet 3 is removed, and the IC module 4' is separated by a removing tool 12 from the material 1. |
