发明名称 MANUFACTURE OF RESIN-SEAL SEMICONDUCTOR DEVICE
摘要 PURPOSE:To reduce a production cost by forming a device having an auxiliary resin unit different from the resin unit of a package body on the side of a heat sink, thereby enabling to eliminate the step of removing burr of inefficient workability. CONSTITUTION:A lead frame 2 is mounted in a transfer molding die to resin- seal it, and the die which has a recess at the position corresponding to the side of a heat sink 3 of a cavity is used as a die. In the molding step, resin is filled from a gap between a die at the contact 11 between the resin unit 1 and the auxiliary resin unit 10, and the sink 3 in a recess for the unit 10 of the die, and the unit 10 different from the unit 1 is formed at the exposed unit of the sink 3. After such a device is obtained, a frame such as an outer frame 2 unnecessary for the frame 21, a dam unit 22, and a connector 23 is cut off. A force is applied in a direction of an arrow 12 simultaneously upon the lead cutting step, and the unit 10 is hit off.
申请公布号 JPS6065555(A) 申请公布日期 1985.04.15
申请号 JP19830173506 申请日期 1983.09.20
申请人 TOSHIBA KK 发明人 KATOU TOSHIHIRO;KUDOU YOSHIMASA;MIYAMOTO MITSUGI
分类号 H01L23/48;H01L21/56;H01L23/31;H01L23/495;H01L23/50 主分类号 H01L23/48
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