HYBRID INTEGRATED CIRCUIT

摘要

PURPOSE:To obtain a hybrid integrated circuit which has a preferably sealing structure of a power transistor by providing a groove having an inverted tapered surface at the periphery of a heat sink. CONSTITUTION:A groove 19 is formed at the periphery of a heat sink 13. The groove 19 has an inverted tapered surface 18 to act to prevented the separation of a sealing resin layer 15 from the sink 13 due to a heat cycle. A power transistor 14 is secured through a solder inside the groove 13, the resin layer 15 of an epoxy resin is coated to cover the transistor 14, thereby protecting it. The resin 15 is fillted also in the groove 19. The surface 18 may be formed inside or outside.