| 摘要 |
PURPOSE:To reduce stress applied to a semiconductor element further by sealing a structure consisting of a stage, a plurality of leads and a metallic plate arranged while holding the element with plastics. CONSTITUTION:An opposite stage (a metallic plate) 40 additionally fitted to a second lead frame 32b is mounted through an insulating material 38 while holding an element 33 disposed on a stage 37 as a first stage frame 32a. In the structure of a plastic IC31 constituted in this manner, stress applied to the element 33 is reduced even when a sealing resin is expanded or contracted because the opposite stage 40 is positioned in a package while holding the element, and possibility of which cracks, etc. are generated in the element is improved. |
