| 摘要 |
PURPOSE:To prevent the hanging of a bonding wire by protruding and forming an insulating film for obviating a short circuit between a semiconductor chip and the wire from the fringes of the semiconductor chip or a wire connecting terminal. CONSTITUTION:The whole surface of a semiconductor chip 1 except a bonding pad region is covered with an insulating film 10 for preventing a short circuit so as to be protruded from the fringe. Accordingly, even when a bonding wire 2 hangs down, the wire is not in contact with the semiconductor chip 1 owing to the film 10, and the state can be kept till the sealing of a resin. The insulating film may be pasted even to the tip section of a wire connecting terminal 4, and a contact with the semiconductor chip 1 can be prevented by the insulating film 11 even in this case. |
