| 摘要 |
PURPOSE:To contrive the reduction of cost and the improvement of reliability of semiconductor devices by enabling the ultrasonic bonding of aluminum wires by a method wherein the titled device is provided with a transfer table pivoting on rails and a bonding head movable toward the center of the rails, and the bonding lead transfers around a bonding region. CONSTITUTION:When the electrode of a semiconductor element 11 adhered on a lead frame 12 is wire-bonded to leads extending in the periphery of the element 11 by means of aluminum fine wires, with respect to the element 11 on the frame 12 carried immediately under the center of the rails 13, the transfer table 14 pivots on the rails 13 to the fixed position, according to e.g. the radial arrangement of electrodes formed on the element 11. Thereafter, the bonding head 15 on the transfer table 14 moves toward the center, and the electrodes on the element 11 are wire-bonded to the leads in the periphery thereof by means of aluminum wires projected out of a capillary 17 provided at the tip of a bonding arm 16. |
