| 摘要 |
PURPOSE:To enable the accurate control of the amount of bending of a mask exposure by a method wherein the titled device is equipped with a position control mechanism to make the mask abut against or close to a plate object to be processed and an atmospheric pressure control mechanism to control the difference in atmospheric pressures between both surfaces. CONSTITUTION:A wafer 33 is held by adsorption by means of pipes 35 and 37 and a wafer chuck 32 drawn in vacuum V. Next, the mask 11 and a mask holer 10 are fixed by adsorption in vacuum V via pipes 8 and 9. A wafer 33 on the chuck 32 is made to abut against the mask 11 by control of the supply pressure of an air chamber 25 by setting the initial amount of rise by means of a transfer amount setter 49. A spherical base 31 is fixed to a receiver plate 30 by evacuation of the air chamber 45 after parallel leading. While the target position of the mask and the wafer is confirmed through an alignment scope 44, the mask pattern and the wafer pattern are brought to agreement by transfer of alignment tables 12, 13, and 17. |
