| 摘要 |
PURPOSE:To obtain the titled composition of low resistance with good resistance stability, by incorporating thermoplastic and/or thermosetting resin(s) with copper powder, specific isocyanuric acid, and polyphosphoric acid. CONSTITUTION:The objective composition can be obtained by incorporating (A) a thermoplastic and/or thermosetting resin(s) with (B) copper powder of >=95% (pref. >=99%) purity with an average particle size <=200mu (pref. <=50mu), (C) 1,3,5- tris(4-t-butyl-3-hydroxy-2,6-dimethylbenzyl) isocyanuricacid, and (D) polyphosphoric acid containing >=72.4wt% of P2O5. The amounts to be used for the above components are as follows: The component (B): 50-2,000pts.wt. based on 100pts. wt. of the component (A). The component (C): >=0.01pt.wt. based on 100pts.wt. of the components (A) plus (B). The component (D): >=0.01pt.wt. based on 100pts. wt. of the components (A) plus (B). |
