| 摘要 |
PURPOSE:To examine foreign matters on the surface of an object having a rugged surface by judging only the reflected light of light for examination, which can be detected with all of plural detecting means, as the reflected light from foreign matters. CONSTITUTION:The light for examination is irradiated from above the center part of a semiconductor wafer 9, and the reflected light is detected simultaneously by plural reflected light detecting means 17 which are provided to face individual directional step faces 20. Since the reflected light from a foreign matter 22 has all directions and is detected by all detecting means though the reflected light from the step face 20 has directivity and is detected only by a specific detecting means in accordance with the direction, the foreign matter 22 is detected in distinction from a pattern consisting of ruggedness provided on the semiconductor wafer 9. |
