发明名称 POLYAMIDEIMIDE RESIN MOLDING AND THERMAL TREATMENT THEREOF
摘要 PURPOSE:To obtain the titled molding with a better wear resistance without lowering of strength are impact resistance by thermally hardening a polyamideimide resin molding formed by melt extrusion with the atmosphere of vacuum, an inert gas or the like when the heating temperature is within a specified range. CONSTITUTION:A polyamideimide resin molding mainly composed of a polyamideimide resin having as main component unit the repeated unit expressed by the formula I (Ar represents trivalent aromatic group containing one or more carbon's six-membered rings; R bivalent aromatic and/or fatty residual group; and R' H, methyl or phenyl) as molded by melt extrusion is hardened by thermal treatment with the atmosphere of vacuum, inert gas or CO2 gas when the heating temperature T is within the range as expressed by the formula II [Tg presents the glass transition temperature ( deg.C) of the polyamideimide resin hardened by thermal treatment and T heating temperature ( deg.C)] to obtain the desired molding.
申请公布号 JPS6063140(A) 申请公布日期 1985.04.11
申请号 JP19830171095 申请日期 1983.09.19
申请人 TORAY KK 发明人 SUMIYA TAKASHI;YABE KENJI;MIMURA TAKASHI
分类号 B29C47/00;B29C71/02;B29K77/00;C08G73/10;C08J3/24;C08J7/00 主分类号 B29C47/00
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