| 摘要 |
PURPOSE:To ensure effective heat dissipation from the entirety of a heat sink by a method wherein a mechanical buffer layer which is a soft metal layer composed of such a soft, conductive material as Pb or Pb-Sn solder with its softness greater than that of Cu is provided on the mounting surface of the heat sink and the ruggedness on the soft metal surface is smoothed under pressure during the process of packaging a semiconductor device using screws. CONSTITUTION:On the lower surface of a Cu-made heat sink 3 provided with screw holes 2 for mounting, an approximately 100mum-thick soft metal layer 4 is formed of such a conductive material as Pb or Pb-Sn solder. This is screwed tight to an external heat-dissipating body 5 using mounting screws 6 for packaging. The interfacial ruggedness between the heat-sink 3 and external heat-dissipating body 5 is smoothed as the soft metal layer 4 is rolled under pressure. Reliable interfacial adherence is established because recesses, protrusions, or scars that may be present in the heat-radiating surface of the external heat-dissipating body 5 or of a ceramic package 1 for a semiconductor device may be smoothed because of the gap-filling effect of the soft metal layer 4, which ensures excellent heat-dissipation. |
