| 摘要 |
<p>A ceramic substrate carrier (1) has side contact pins (2) and surface component contacts (3). At the positions where components (5) are to be mounted and connected to the contacts (3), rectangles (4) of flat format adhesive are applied by a silk-screen process. The components (5) are then positioned upon their respective rectangles of adhesive to adhere the components in place. The electrical connection of component leads (6) to their respective surface contacts (3) is then effected by soldering.</p> |
