发明名称 SPUTTERING APPARATUS
摘要 PURPOSE:To generate early plasma even at low voltage in a DC bipolar system sputtering apparatus by placing at least one gas introducing inlet at a position close to a target. CONSTITUTION:A DC bipolar system sputtering apparatus contains a substrate supporting stand 2 acting as an anode and a target 5 acting as a cathode in a divided chamber provided with a gas introducing pipe 7. A gas introducing pipe 9 is placed besides the pipe 7 so that the gas introducing inlet 9a of the pipe 9 is positioned by the side of the target 5 at about 5cm interval. Early plasma is well generated only by applying about 400V negative voltage to the target 5.
申请公布号 JPS6063366(A) 申请公布日期 1985.04.11
申请号 JP19830169441 申请日期 1983.09.16
申请人 FUJITSU KK 发明人 NAGASHIMA SETSUO
分类号 C23C14/36;C23C14/34;H01L21/203;H01L21/285 主分类号 C23C14/36
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