发明名称 MANUFACTURE OF HYBRID INTEGRATED CIRCUIT
摘要 PURPOSE:To obtain a product having stable quality by using a rectilinear external lead, using a beltlike solder, to which a plurality of notches are formed, and soldering the external lead in a hot atmosphere. CONSTITUTION:A notch 7a is determined by the thickness of a beltlike solder 7 and a pitch W among external leads 6a by the quantity of solder required, and a section 7c is selected in such a manner that width is narrowed properly, a bending is prevented and the section 7a is melted first. The wide width sections 7b of the solder 7 are fixed temporarily on electrode terminals 2 for an insulating substrate 1, to which an electronic part is mounted, through thermocompression, etc., and a frame-shaped external lead 6 with the external leads 6a is stacked. When a temporary assembly is introduced in a hot atmosphere, solder narrow width sections 7c melt first, and the solder 7 is divided equally in a proper quantity. The wide width sections 7b also melt, and the external leads 6a and the electrode terminals 2 are soldered. A hybrid IC is sheathed with a resin 5, and completed. According to the constitution, the quantity of solder and the hot atmosphere can be controlled, products having stable quality are obtained, and automation and mass production are also facilitated.
申请公布号 JPS6062145(A) 申请公布日期 1985.04.10
申请号 JP19830171455 申请日期 1983.09.16
申请人 MITSUBISHI DENKI KK 发明人 KAMATA TSUTOMU
分类号 H05K3/34;H01L21/48;H01L21/98;H01L23/50;H01L25/00 主分类号 H05K3/34
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