发明名称 RESIN SEAL TYPE SEMICONDUCTOR DEVICE
摘要 PURPOSE:To improve adhesive strength between a lead frame and a resin and wetproofing by forming a stepped section on the bed side between both regions of the lead frame with a bed region for a pellet and a radiator plate region, sealing the whole periphery of the stepped section with the resin and exposing only the radiator plate region to the outside. CONSTITUTION:A stepped section 24 is formed between a radiator plate section 23 for a lead frame 21 made of a metal and a bed section 22 for a pellet, inner leads 15 corresponding to electrodes for the pellet are connected 14, the whole periphery of the bed section 22 side is sealed with a resin including the pellet 11, the connections 14 and the inner leads 15, and only the radiator plate section is exposed. According to the constitution, the effect of heat dissipation is not lowered on a mounting in a circuit substrate, the lead frame 21 is in contact with the resin 17 on both sides of the bed section 22 and adhesive strength is improved, moisture does not reach to the pellet 11 even when moisture permeates from the interface b between the radiator plate section 23 and the resin 17 and wetproofing is enhanced, and a device having high reliability is obtained.
申请公布号 JPS6062140(A) 申请公布日期 1985.04.10
申请号 JP19830169869 申请日期 1983.09.14
申请人 TOSHIBA KK 发明人 KAWAUCHI MASARU
分类号 H01L23/28;H01L23/495 主分类号 H01L23/28
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