| 摘要 |
PURPOSE:To enable to preferably bond and to prevent a damage such as a crack of an insulating film under an electrode portion by softening the spherical portion at the end of a fine metal wire while covering it with high temperature inert atmosphere and bonding it. CONSTITUTION:A bonding arm 4 for supporting a capillary 5 is moved upward or downward by a drive unit. Inert gas supplied form a supply source is flowed through a gas guide tube 8 as by an arrow A, heated to a high temperature by a heater 9, injected downward from an injection base 7 to cover a spherical portion 3a at the end of a fine copper wire 3 from the lower end of the capillary 5 to prevent if from oxidizing, and to softening it. Thus, when the capillary 5 is moved down and contacted under pressure by a supersonic vibration on an aluminum electrode portion 2 on a semiconductor element 1, the softened spherical portion 3a is preferably bonded without repelling the electrode portion 2. The temperature of the inert gas is set to a temperature for softening the spherical portion 3a of the wire 3, i.e., the recrystallizing temperature of copper. |
