| 摘要 |
PURPOSE:To enable to improve the bonding accuracy by operating a manipulator while visually observing a plurality of bumps formed on an Si chip on a monitor. CONSTITUTION:An Si chip 5 to be bonded is held, and an observation window 8 for an Si image pickup tube 9, a manipulator 6 capable of adjusting and operating the position, and a base 10 for holding the manipulator 6 and a unit 11 to be bonded to the chip 5 are provided. Further, a light source 14 for emitting the chip 5 and the unit 11, cameras 15, 16 disposed at the position focused to the bonding position perpendicularly, and a monitor 18 connected in a circuit to the cameras 15, 16 and the tube 9 are provided. The bumps are positioned and bond- ed while visually observing by utilizing the face that the Si is transparent to infrared light having 1.1.mum or higher of wavelength and the thickness of the chip 5 is thin at approx. 500mum. |
