| 摘要 |
A multilayer printed circuit board, in which the risk of damage during removal and replacement of components is reduced, is formed from layers of epoxy-glass carrying conductors (6,7). Connection pins (3) of components (2) mounted on a face of the circuit board (1) extend through holes (8) in the circuit board (1) and protrude from the opposite face. A polyimide-glass layer (13) covers the opposite face of the circuit board (1) and carries conductive pads (9) for connection to the ends of the pins (3) by means of solder (14). The polyimide-glass (13) has a higher transition temperature (260 DEG C-280 DEG C) than that of the epoxy-glass (120 DEG C) so that it suffers minimal loss of adhesion to the pads (9) at the temperature of the molten solder (220 DEG C-250 DEG C). <IMAGE> |
