| 摘要 |
PURPOSE:To prevent resist from remaining with a positive resist developing machine by placing a semiconductor substrate with the front side faced downward and supplying a developing soln. thereto. CONSTITUTION:A semiconductor substrate 201 with the front side faced downward is fixed to a wafer chuck 202. A spin motor 203 runs and a developing soln. 205 is supplied upward by a nozzle 204 provided in the lower part, by which the substrate is developed. The developing soln. reacting with resist falls and therefore said soln. is not fixed to the wafer surface, by which the soln. is replaced with a fresh developing soln. at higher efficiency and remaining of the dissolved resist on the wafer surface is obviated. The possibility of remaining of the resist is thus thoroughly eliminated. |
