| 摘要 |
PURPOSE:To unnecessitate contact pads at contact parts by a method wherein, when an insulation film is adhered on the first wiring layer provided in an IC element, a contact hole is bored therein, and the second wiring layer is connected through it, the width of this hole is made smaller than that of the first wiring layer or that of the second wiring layer, or smaller than those of the both. CONSTITUTION:An insulation layer is adhered on the first wiring layer 11, and when the second wiring layer is connected to the first wiring layer 11 by boring the contact hole 13, the following process is taken. That is, the width of the hole 13 is made smaller than that of the first wiring layer 11 or the second wiring layer 12, or smaller than the sidths of both of the first and second wiring layers 11 and 12. Thus, a wide contact pad part becomes unnecessitated between the wiring layers 11 and 12, and so the integration degree of elements is enhanced. |
