| 摘要 |
A multilayer metal/organic polymer laminate structure is provided wherein the metal is stainless steel which has been plated with a duplex coating of a chromium containing oxide overlying a metallic chromium layer. One or more adhesive polymer layers are adhesively bonded to at least one chromium containing oxide layer. A non-adhesive polymer layer is optionally bonded to an adhesive polymer layer. Alternatively, a second metal layer may be applied to an adhesive polymer layer to form a metal/plastic/metal laminate structure. The multilayer metal/organic polymer laminate structure may be used as a cable shielding tape for electrical cables, communications cables or lightwave data transmission cables. |
