| 摘要 |
PURPOSE:To simplify the manufacturing process, and moreover to enhance the heat dissipating property and the insulating property of a semiconductor device by a method wherein the insulating interval between the conductor of an assembled body and the base of sealing resin is held by a filler mixed in the sealing resin. CONSTITUTION:A frame 6 is a square shape hollow body having a closed base, for example, and a projected part 61 of height the same with the hollow body is provided being integrated in one body to the central part thereof. After resin 7 mixed with a filler 71 of large diametrical grains size, for example, is filled up to the 1/3 grade, for example, of height thereof in the frame 6 like this, an assembled body 4 consisting of an inside terminal plate 1, an outside terminal 2 and a semiconductor pellet 3 is inserted therein. After then, the whole is put in a vacuum, and after a deaerating process is performed to draw out air bubbles in the resin 7, resin is filled moreover up to the top of the frame 6, and after the resin is hardened, by removing the frame 6, a resin sealed semiconductor device is obtained. |
