| 摘要 |
PURPOSE:To align an orientation flat in a semiconductor wafer in a short time by previously forming a notched groove increasing contact friction between the arcuate surface of the wafer and the surface of an alignment bar along the longitudinal direction of the outer circumferential surface of the bar when the orientation flat is aligned by the rotation of the alignment bar of a cassette stage. CONSTITUTION:A groove is formed positioned in the longitudinal direction at the central section of a cassette stage 2, an alignment bar 1 is inserted while the surface is projected into the groove, a belt 7 is stretched over a pulley 3 mounted to the end section of the bar, and the bar 1 can be turned by a motor 4, a driving shaft 5 and a pulley 6. A plurality of semiconductor wafers 8 are erected on mutually opposite cassettes 9 for conveyance, the cassettes 9 are disposed on the stage 2, and the surface of the bar 1 is brought into contact with the arcuate surfaces of the wafers 8 and the bar 1 is rotated to align the positions of flats 8a. A notched groove 10a in the longitudinal direction is dug previously to the surface of the bar 1 at that time, and the arcutate surfaces of the wafers 8 are rubbed and turned by the conical ridge sections 10b and 10c of the groove and the wafers are not slid. |
