| 摘要 |
PURPOSE:To prevent the excessive exposure due to the reflected light at pattern exposure by performing the last precess of spattering of the metal for wiring by using the mix gas of an inert gas and a reactive gas. CONSTITUTION:The substrate 1 treated by the predetermined process is subjected to spattering using an inert gas 4 to deposit the metal film for wiring 2 on the substrate 1. Next, in the last process of the spattering, spattering using the mix gas 11 of the inert gas and a reactive gas is performed to form a reactive product layer 12 on a surface of the film 2. Then, the layer 12 is coated with a photosensitive resin film 5 which is irradiated with the light 7 through a patterning masking plate 6 to perform exposure. The pattern on the plate 6 is transferred onto the film 5 and a resin pattern is obtained. At this time, the layer 12 is formed on the film 2 so that reflection of the light 7 is small at the exposure. Accordingly, the excessive exposure to the film 5 is prevented and the resin pattern of high accuracy can be obtained. |
