| 摘要 |
PURPOSE:To prevent the increase of a chip area even on the arrangement of a check pattern for a mask by forming a check pattern for mask alignment under another check pattern having an object different from that of the check pattern for mask alignment. CONSTITUTION:Check patterns A, B are formed to a semiconductor chip 1. Al wirings (patterns C) are formed on at least one parts of the patterns A, B. Accordingly, the area of a semiconductor chip can be reduced by arranging the wirings on at least one parts of the patterns A, B. |
