| 摘要 |
An improved apparatus for the plating of the projecting, bent contact elements of electronic components encapsulated in ceramic packages-suitably of the type known as C-Dips-is provided with a continuous flexible conveyor belt of stainless steel running in a vertically aligned loop with a web of the belt horizontal. The edges of the belt are bevelled to receive, pressed thereover, a gap between the ceramic package and the selvedge associated with the untrimmed lead frame of the contact elements in a frictional, reversible grip. The parts to be plated are forced onto the edge of the intermittently moving belt during its period of rest, and are carried through the treatment stations of the plating apparatus as the belt progresses from a loading station towards an unload station, after the parts have been plated, where the individual encapsulated electronic components are stripped from the belt into receiving trays or magazines.
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