| 摘要 |
A multiple thermocouple connector panel including a row of standard thermocouple connectors having terminals with rear ends normally adapted to be connected to lead wires, characterized by terminal extenders connected to such rear ends which extend the effective length of the terminals to the rear of the connectors so as to provide for ease of attachment of lead wires after assembly of all the connectors in the panel. The connectors may be mounted between a faceplate and a mounting plate with the faceplate and mounting plate abutting respective proximal surfaces of the connector housings. The mounting plate is made of insulating material and is provided with terminal openings through which the terminal extenders extend and project beyond the rear of the mounting plate, each terminal being transversely located by a respective one of the openings and mutually insulated by a portion of the mounting plate.
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