Shield for improved magnetron sputter deposition into surface recesses

摘要

A system for vacuum depositing a material onto a sample having a surface recess, such as a hole or channel, therein. The system includes a vacuum chamber capable of attaining a high vacuum and a vacuum deposition source in the chamber for emitting atoms. An energy source is connected to the vacuum deposition source to initiate emission of the atoms therefrom. A sample having an upper surface disposed in the vacuum chamber opposite the vacuum deposition source is adapted to receive the atoms emitted from the vacuum deposition source. The sample has a surface recess therein with a wall substantially perpendicular to the plane of the sample. Finally, a component for eliminating undesirable depositing angles of atoms is disposed intermediate the vacuum deposition source and the sample in order to improve the ratio of recess wall to sample surface deposition. Another important feature of the component for eliminating undesirable depositing angles is its ability to reduce heat generated on the sample during the deposition process.