| 摘要 |
An alloy of silicon and metal (e.g., gold) formed at the eutectic temperature thereof permits the formation of a bonded contact of the metal (e.g., gold) to silicon carbide. Such a contact is useful for securing a wire to the silicon carbide, for forming alloy sites thereon, etc. A nail head bonder with a threadable heated tip may be utilized in the use of this method.
|
