| 摘要 |
PURPOSE:To improve the workability by elimination of the mask alignment of a metal mask by a method wherein polyimide series resin is applied after a bump junction metal is formed, in electrode formation by the use of a solder ball. CONSTITUTION:An aluminum wiring 3 is formed on an oxide film 2 of an Si semiconductor wafer 1, being then convered with a final passivation film 4, which is etched for window opening, resulting in the exposure of the wiring 3, and the bump junction metal 5 is formed thereon. Next, the polyimide series resin 6 is applied with a thickness approximately of the diameter of the solder ball, a window hole being bored in the metal 5 by photo process, and the solder ball 7 being then put in. This ball 7 does not need to be put in by positioning, but can be put in a manner of rolling over the wafer. Thereafter, flux 8 is applied to the metal 5 and the ball 7, which ball 7 is then heated. As a result of heating, the ball 7 turns by the effect of the flux 8 into a solder electrode 7' formed on the metal 5, and afterwards the resin 6 is removed. |
