| 摘要 |
<p>PURPOSE:To enable bonding to be accomplished between copper and resin and allow to be applied for production of multi-layered printed wiring board, by forming oxide layer on copper surface followed by reducing said layer to convert into metallic copper to effect both increased bond strength and acid resistance. CONSTITUTION:Copper surface is treated with an aqueous alkaline solution containing such an oxidizing agent as sodium chlorite to form an oxide layer followed by partly eliminating said layer to allow metallic copper to be exposed, which is then treated with a reducing agent (e.g., formaldelyde, boron sodium hydride) -contg. solution, thus enabling the objective bonding to be accomplished.</p> |
