| 摘要 |
<p>To mount an element (10) on a circuit board (2), element holding portions (113a, 113b) are moved quickly to an intermediate position immediately before a position where the element (10) is to be mounted and are then moved slowly from the intermediate position to a position where the element (10) comes in contact with the circuit board (2). A movement control system for the above-described operation incorporates a program in which the operating speed and load can be changed in accordance with the properties of chip elements. Thus, it becomes possible to mount chip elements rapidly and more reliably than with existing devices.</p> |
