| 摘要 |
Methods involve holding an array of semiconductor devices on a substrate by means of a polyester mesh screen and photoresist material. After the array of devices have been formed by photoresist and etch techniques from a slice waxed to the substrate, the photoresist material is removed from the array but not from the substrate surrounding the array. The polyester mesh screen is placed over and forced against the array and photoresist material while the wax is removed with a solvent. The solvent softens the photoresist material so that the forced screen embeds in the photoresist. Upon removal from the influence of the solvent, the photoresist material rehardens fastening the screen to the substrate with the devices retained between the screen and the substrate in their original orientation and array. The assemblage of substrate, photoresist material and screen permits the devices, no longer waxed to the substrate, to be transported to other operations where the screen is peeled off and the devices removed. |
