| 摘要 |
PURPOSE:To stably perform the attaching of a pellet in high reliability by covering the back surface of a semiconductor element with thermosetting resin and then bonding an organic bonding material to a supporting member. CONSTITUTION:Preferable thermosetting resin has particularly 160 deg.C or higher of glass transition point, 350 deg.C or higher of thermal decomposition starting temperature. The prescribed aromatic dihalide dicarboxylate such as dichloride terephthalate is mixed with the prescribed aromatic diamine of aromatic polyether amide, polycarbonate, aromatic polyester, polysulphone, polyether sulphone, polyphenylenesulfide, polyether imide or 2,2-bis[4-(4-aminophenoxy)phenyl] propane having the prescribed representative repetition unit, silver powder or silica is suitably added, toluene is coated as a solvent on the back surface of an element 2, fusion-bonded by heating onto a tab 4 of a leadframe 3, wired with wirings 5, and then sealed with resin 6. According to this structure, the film 4 can be uniformly coated, the bonding yield and the reliability can be improved. |
