| 摘要 |
PURPOSE:To absorb stress on a bending to a plastic material and prevent the generation of cracks, etc., and to improve reliability by forming the whole or one part of a bent section in a lead frame buried in a package by the plastic material softer than a lead material. CONSTITUTION:The outside and the inside as one parts of a lead material in a bent section 7 are formed by plastic materials 8 and 8a having properties softer than the lead material and easy to be deformed plastically. Leads can be bent and molded easily by forming the bent sections 7 in such structure, and stress generated in the bent sections is absorbed to the plastic materials, thus avoiding the influence of stress on external lead bonding sections 6a in a package. Accordingly, the generation of cracks, etc. in the bonding sections or sections in the vicinity of the bonding sections can be prevented, and fixed strength can be kept, thus improving the reliability of a semiconductor device. |
