| 摘要 |
Test structure for identifying semiconductor chips (1) in relation to at least two specified characteristics, consisting of at least one contact area pair disposed on the chip surface with the contact areas (2, 3), with a parallel network (4) electrically containing at least two electronic devices (14) connected in parallel, and two conductors (5) which each connect an end of the parallel network (4) to one of the two contact areas (2, 3) and also a process for identifying semiconductor chips using test structures according to the invention. <IMAGE> |
