| 摘要 |
An arrangement for the solderless mounting of an integrated circuit chip carrier (13) on a printed wiring board (10). A socket (16), cemented to the board, is provided within which a leadless chip carrier (13) is fitted. Featured is a contact interface element (20) which presents an array of electrically conductive annular springs (27) which electrically connect the contact pads (14) of the chip carrier (13) and the contact pads (15) of the printed wiring board (10). The interface element (20) is clamped between the chip carrier (13) and the printed wiring board (10) by means of a compression spring (31) operating on the upper surface of the chip carrier (13).
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