| 摘要 |
A process of reacting a selective area of an article with a heated liquid, such as by immersion in a heated electroless plating bath, utilizes a holder which is particularly suitable for use in retaining a plurality of printed circuit boards to be immersed in an electroless plating bath. The holder comprises a rigid base and a heat expandable foam bed mounted to the base, the foam bed having slits therein into which the printed circuit board is placed and held. Upon immersion of the article, the foam bed thermally expands to mask the article from the bath in the areas covered by the bed.
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